| Packaging | |
| The packaging is simply the entire makeup of a unit of memory, in most cases, the SIMM. Since the memory chips themselves are way too small, they must be combined and put on a medium that can be worked with and added to a system. | |
| Package Terminology | |
| BGA | Ball Grid Array |
| CBGA | Ceramic Ball Grid Array |
| CDIP | Glass-Sealed Ceramic Dual In-Line Pkg. |
| CDIP SB | Side-Braze Ceramic Dual In-Line Pkg. |
| CFP | Both Formed and Unformed CFP |
| CPGA | Ceramic Pin Grid Array |
| CZIP | Ceramic Zig-Zag Pkg. |
| DFP | Dual Flat Pkg. |
| DIMM | Dual-In-Line Memory Module |
| FC/CSP | Flip Chip / Chip Scale Pkg. |
| HLQFP | Thermally Enhanced Low Profile QFP |
| HQFP | Thermally Enhanced Quad Flat Pkg. |
| HSOP | Thermally Enhanced Small-Outline Pkg. |
| HSSOP | Thermally Enhanced Shrink Small-Outline Pkg. |
| HTQFP | Thermally Enhanced Thin Quad Flat Pack |
| HTSSOP | Thermally Enhanced Thin Shrink Small-Outline Pkg. |
| HVQFP | Thermally Enhanced Very Thin Quad Flat Pkg. |
| JLCC | J-Leaded Ceramic or Metal Chip Carrier |
| LCCC | Leadless Ceramic Chip Carrier |
| LGA | Land Grid Array |
| LPCC | Leadless Plastic Chip Carrier |
| LQFP | Low Profile Quad Flat Pack |
| MCM | Multi-Chip Module |
| MQFP | Metal Quad Flat Pkg. |
| OPTO | Light Sensor Pkg. |
| PDIP | Plastic Dual-In-Line Pkg. |
| PFM | Plastic Flange Mount Pkg. |
| PLCC | Plastic Leaded Chip Carrier |
| PPGA | Plastic Pin Grid Array |
| QFP | Quad Flat Pkg. |
| SDIP | Shrink Dual-In-Line Pkg. |
| SIMM | Single-In-Line Memory Module |
| SIP | Single-In-Line Pkg. |
| SODIMM | Small Outline Dual-In-Line Memory Module |
| SOJ | J-Leaded Small-Outline Pkg. |
| SOP | Small-Outline Pkg. (Japan) |
| SSOP | Shrink Small-Outline Pkg. |
| TFP | Triple Flat Pack |
| TO/SOT | Cylindrical Pkg. |
| TQFP | Thin Quad Flat Pkg. |
| TSOP | Thin Small-Outline Pkg. |
| TSSOP | Thin Shrink Small-Outline Pkg. |
| TVFLGA | Thin Very-Fine Land Grid Array |
| TVSOP | Very Thin Small-Outline Pkg. |
| VQFP | Very Thin Quad Flat Pkg. |
| VSOP | Very Small Outline Pkg. |
| When dealing with the "packaging" RAM comes in, you also must consider single and double sided modules, sometimes referred to as single and double RAS SIMMs/DIMMs. Here is a small chart which illustrates chip sizes, and basic memory configurations: | |
| Type | Pins | Chips | Double Sided | Size |
| 1 x 32 SIMM | 72 | 8 | 4MB | |
| 2 x 32 SIMM | 72 | 16 | * | 8MB |
| 4 x 32 SIMM | 72 | 8 | 16MB | |
| 8 x 32 SIMM | 72 | 16 | * | 32MB |
| 16 x 32 SIMM | 72 | 8 | 64MB | |
| 32 x 32 SIMM | 72 | 16 | * | 128MB |
| 1 x 64 DIMM | 168 | 8 | 8MB | |
| 2 x 64 DIMM | 168 | 8 | 16MB | |
| 4 x 64 DIMM | 168 | 8 | 32MB | |
| 4 x 64 DIMM | 168 | 16 | * | 32MB |
| 8 x 64 DIMM | 168 | 16 | * | 64MB |
| 16 x 64 DIMM | 168 | 16 | * | 128MB |
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Last Update: 8:27 PM 11/5/01