What is Thermal Pads?
| Thermal Pads |
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A ThermalPad looks very similar to Thermal Tape except that it does not have the same adhesion to the surfaces. Typically ThermalPads are placed on the bottom of a heatsink surface and the chip, but another heatsink retention mechanism is required to prevent the heatsink from sliding off of the chip. The pad differs from the tape and from ThermalGrease in that it is based upon a paraffin base. The waxy substance is solid during low temperatures, but as a chip heats up, that paraffin base melts spreading the thermonic transfer elements inside the pad into the gaps between the chip and heatsink. This is the most common form of Thermal Compound included with stock cooling solutions included with retail processors. The thermal resistance of a typical Thermal Pad is rated around .05 Cin^2/W. Or: Thermally Conductive Insulators Pads are designed to be clean, grease free and flexible. The combination of a tough carrier material such as fiberglass and silicone rubber which is conformable, provides the engineer with a more versatile material than mica or ceramics and grease. T-Pads minimize the thermal resistance from the case of a power semiconductor to the heat sink. T-Pads electrically isolate the semiconductor from the heat sink and have sufficient dielectric strength to withstand high voltage. They are also tough to resist puncture by the facing metal surface. |
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