| Thermal Compounds |
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All ThermalCompounds are rated on their ability to transfer heat between surfaces. The rating is referred to as the thermal resistance. This is the amount of heat that is absorbed by the compound rather than being transferred through it to the other surface. As a result, the lower the thermal resistance of the compound the more effective it will be at transferring heat between the chip and the heatsink. This is a very important factor when evaluating the potential performance of a ThermalCompound. Another number that is thrown around by manufacturers is thermal conductivity. This is the opposite of resistance in that it shows how much heat energy can be transferred through the compound. Therefore, the more effective thermal compound will have a high thermal conductivity rating. Most manufacturers tend to not use this number, but you should be aware of it. Another concern with the ThermalCompound is their thickness. Typically the ThermalCompound should have the least amount of material needed to form a thin layer between the chip and the heatsink while still allowing it to fill in all those gaps. If a ThermalCompound is put on too thick, it reduces the effectiveness of the compound. |